Concept processor · DOMVYBE / 13
ARCLITH One
Every layer, all the way down.
A concept — not a real product, not for sale.
Scroll to descend
01 — Package
The module
A bare silicon die at the centre, high-bandwidth memory beside it, hundreds of capacitors around the edge.
02 — Die
Under the microscope
Polished silicon gives way to its floorplan — cores, cache and memory arrays, coloured by thin films.
03 — Interconnect
Copper, in layers
Above the transistors, stacked copper wiring carries power and signal between billions of switches.
04 — Transistor
Gate all around
Stacked silicon nanosheets, wrapped on every side by the gate. A wave of switching passes along the row.
05 — At scale
Then, by the thousand
One module is a starting point. A data hall is thousands of them, working as one.
- Stage
- 01 / 05
- Frame
- 0001 / 0000
- Film
- Google Veo + code
- 01StiffenerSteel ring that keeps the package flat
- 02DieBare silicon, 26 × 26 mm
- 03Memory6 high-bandwidth stacks
- 04CapacitorsDecoupling, right at the die
- 05Substrate55 × 55 mm, 16 routing layers
- 06ContactsBall-grid array to the board
02Anatomy
Six layers,
one module
Keep scrolling. The package turns, then lifts apart layer by layer — from the board contacts to the steel ring on top.
- Turn
- 000°
- Apart
- 00%
- Layers
- 06
0
Cores · 8 performance, 16 efficiency
0GB
High-bandwidth memory on package
0W
Design power envelope
0
Frames in the descent film
Concept values for a fictional processor — not measurements or benchmarks.
03The die
Put it
to work
Pick a workload and watch where the heat goes. Point at a block to see what it does.
Floorplan
26 × 26 mm of silicon
Eight blocks share one die. Hover or tap one to read it.
- Hotspot
- 38 °C
- Power
- 024 W
- Busiest
- —
Simulated heat map · concept floorplan
04Specifications
On paper
Every figure here is a concept value, chosen to be plausible for a data-centre processor — not a claim about a real chip.
| Process | 2 nm class, gate-all-around nanosheets |
|---|---|
| CPU | 24 cores — 8 performance, 16 efficiency |
| Accelerator | Dedicated neural block, 4 matrix engines |
| Memory | 192 GB high-bandwidth, 6 stacks on package |
| Die | 26 × 26 mm |
| Package | 55 × 55 mm, 16-layer substrate, ball-grid array |
| Power | 350 W design envelope |
| Cooling | Direct liquid cold plate |
05At scale